Compound Semiconductors Explained: GaN, SiC, and InP in the AI & EV Era
Explore how GaN, SiC, and InP foundries power AI data centers, EVs, and 800G/1.6T optics, overcoming substrate supply risks and scaling to 200mm wafers.
Explore how GaN, SiC, and InP foundries power AI data centers, EVs, and 800G/1.6T optics, overcoming substrate supply risks and scaling to 200mm wafers.
Explore how MOCVD drives GaN and InP compound semiconductor production. Learn about epitaxial growth mechanics, market trends in AI optics, and supply constraints.
Explore how silicon photonics foundries use SOI wafers, CMOS tools, and III-V lasers to manufacture high-speed PICs for AI data centers and 800G networks.
Explore electrical semiconductor metrology and inspection methods, from SMUs and 4-point probes to e-beam VC and THz spectroscopy. Learn how 3D architectures, KLA market dominance, and geopolitical export controls shape chip yield and market growth.
Explore how X-ray semiconductor metrology (CD-SAXS, HRXRD, XRR) enables 3D GAA nanosheets, HBM stacks, and advanced packaging inspection.